Apple and Broadcom seal $30 billion chip deal for US production

Apple has announced a multi-year agreement with Broadcom valued at over US$30 billion to design and manufacture more than 15 billion chips in the United States. The deal, extending until 2031, is a key part of Apple’s broader commitment to invest US$600 billion in the US economy over four years and reduce its reliance on Asian manufacturing. Source: portafoliocoSource: larepublicaco

The agreement

Under the pact, Broadcom will invest US$1.5 billion to expand and modernize its Fort Collins, Colorado, facility, where advanced radio-frequency components and wireless connectivity chips will be produced. Source: cnnSource: infobae Apple expects the partnership to create hundreds of jobs in the US. Source: lavanguardia Tim Cook, Apple’s CEO, stated that these components “are essential for delivering the incredible performance and connectivity our customers expect.” Source: portafolioco

Strategic context

The deal is part of Apple’s “American Manufacturing Program,” launched last year, and follows a separate US$9 billion chip-purchase agreement with Intel announced in June. Source: cnn It also comes amid rising component costs; Cook recently warned of “inevitable” product price increases due to surging memory and AI-related chip prices. Source: infobae

A note on leadership

One report indicates Cook will step down as CEO on September 1, replaced by hardware chief John Ternus, while Cook remains as executive chairman. Source: larepublicaco Other sources do not mention this transition.

• Disagreement on timeline: Most outlets report the deal as announced in July 2026, but one source notes that Broadcom first mentioned an extended pact on Monday without financial details. Source: larepublicaco